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solder bump
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solder bump lead — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m … Radioelektronikos terminų žodynas
solder bump pad — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m … Radioelektronikos terminų žodynas
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
Lötkontakthügel — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m … Radioelektronikos terminų žodynas
lydmetalinis gūburinis išvadas — statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m … Radioelektronikos terminų žodynas
poutre de brasure — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m … Radioelektronikos terminų žodynas
столбиковый вывод из припоя — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m … Radioelektronikos terminų žodynas
System in package — A System in a Package or System in Package (SiP), also known as a Chip Stack MCM, is a number of integrated circuits enclosed in a single package or module. The SiP performs all or most of the functions of an electronic system, and are typically… … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
